HumiSeal® UV40 Gel is a single component, high solids, UV curable gel. A secondary moisture cure mechanism will cure unexposed areas within 7 days at ambient conditions. The gel fluoresces under UV light to allow inspection. HumiSeal® UV40 Gel is in full compliance with the RoHS Directive 2011/65/EU.
Conformal coatings can be successfully applied to substrates that have been cleaned prior to coating and also to substrates assembled with low residue, “no clean” assembly materials. Users should perform adequate testing to confirm compatibility between the conformal coating and their particular assembly materials, process conditions and cleanliness level. Please contact HumiSeal® for additional information.
HumiSeal® UV40 Gel is intended for automated needle dispensing, but may also be applied manually.
HumiSeal® UV40 Gel is a highly cross linked UV cured material. The cured film has a high degree of environmental and chemical resistance and will be more difficult to remove than traditional coatings. Thermal displacement and mechanical abrasion are suitable options for rework of HumiSeal® UV40 Gel.
HumiSeal® UV40 Gel is photosensitive. The product should not be exposed to direct sunlight or full spectrum fluorescent lighting. HumiSeal® UV40 Gel should be stored at 0 to 35°C, away from excessive heat, in tightly closed opaque containers. Prior to use, allow the product to equilibrate for 24 hours at room temperature. HumiSeal® UV40 Gel is a moisture curing material and care should be taken to protect process vessels and partial containers from moisture. Partial containers must be purged with a dry, inert gas such as dry air, nitrogen or argon, before closure, otherwise premature polymerization by atmospheric moisture will occur.
|Minimum Solids Content||95 %|
|Recommended Coating Thickness*||Up to 2.0 mm|
|Recommended UV Cure†||See TDS for Details|
|Shelf Life at Room Temperature, DOM||12 months|
|Dielectric Withstand Voltage, per MIL-I-46058C||>1500 votls|
|Dielectric Constant, at 1MHz and 25°C per ASTM D150-98||2.5|
|Dissipation Factor, at 1MHz and 25°C per ASTM D150-98||0.01|
|Insulation Resistance, per MIL-I-46058C||8.0 x 1014 ohms (800TΩ)|
|Moisture Insulation Resistance, per MIL-I-46058C||4.7 x 1010 ohms (47GΩ)|
*Thickness will vary based on application equipment and process. User is responsible for confirming suitability of product for intended application.
†Microwave UV cure ovens equipped with “H” style bulbs are recommended