HumiSeal® 1C55 is a single component, VOC-free, low viscosity, fast thermal curing silicone conformal coating. The reduced viscosity and long pot life of HumiSeal® 1C55 make it ideal for dipping and spraying. HumiSeal® 1C55 demonstrates excellent flexibility, contains an optical brightener for inspection under black light and is repairable. HumiSeal® 1C55 coating is RoHS Directive 2011/65/EU compliant.
Conformal coatings can be successfully applied to substrates that have been cleaned prior to coating and also to substrates assembled with low residue “no clean” materials. Users should perform adequate testing to confirm compatibility between the conformal coating and their particular assembly materials, process conditions and cleanliness level. Please contact HumiSeal® for additional information.
A controlled rate of immersion and withdrawal (5-15 cm/min) will ensure even deposition of the coating and ultimately a uniform film.
HumiSeal® 1C55 can be sprayed using conventional spraying equipment. Spray pressure will depend on the specific type of spraying equipment used and operator technique. Spraying should be done in an environment with adequate ventilation so that the vapour and mist are carried away from the operator. The use of thinner is not required or recommended for HumiSeal® 1C55.
HumiSeal® 1C55 may be brushed. Uniformity of the film depends on component density and operator’s technique.
HumiSeal® 1C55 is a thermally cured conformal coating. The actual curing temperature of HumiSeal® 1C55 is dependent upon several parameters such as heat sink characteristics of parts being coated, the type of oven used for curing process, as well as oven loading parameters.
The cure mechanism for HumiSeal® 1C55 may be inhibited by a variety of materials such as amines, acrylates, certain ingredients from latex rubber, etc. It is recommended that process and material compatibility be considered when incorporating HumiSeal® 1C55 into the production environment. Cotton gloves are recommended for operators who will be handling assemblies prior to coating with HumiSeal® 1C55.
|Density, per ASTM D1475||0.98 ± 0.02 g/cm³|
|Min. Solids Content, % by weight per Fed-Std-141, Meth. 4044||99 %|
|Viscosity, per Fed-Std-141, Meth. 4287||195 -400 centipoise|
|Recommended Coating Thickness||50 – 200 microns|
|Recommended Curing Conditions||10 – 15 min @ 105 – 130ºC|
|Time Required to Reach Optimum Properties||15 min|
|Recommended Stripper||HumiSeal Stripper 1091|
|Shelf Life at Recommended Conditions, DOM||12 months|
|Thermal Shock, 50 cycles per MIL-I-46058C||-65°C to 200°C|
|Glass Transition Temperature – DSC||< -65ºC|
|Coefficient of Thermal Expansion – TMA||154 ppm/°C|
|Modulus – DMA||0.7 MPa @ -40ºC
0.6 MPa @ 25ºC
0.5 MPa @ 80ºC
|Dielectric Withstand Voltage, per MIL-I-46058C||>1500 volts|
|Dielectric Breakdown Voltage, per ASTM D149||7000 volts|
|Dielectric Constant, at 1MHz and 25°C per ASTM D150-98||2.4|
|Dissipation Factor, at 1MHz and 25°C per ASTM D150-98||0.01|
|Insulation Resistance, ohms per MIL-I-46058C||5.0 x 1014 (500TΩ)|
|Moisture Insulation Resistance, ohms per MIL-I-46058C||1.0 x 1010 (10GΩ)|
|Fungus Resistance, per ASTM G21||Passes|