HumiSeal® TS 300 is a non-flammable, high temperature, temporary mask designed for use on printed circuit boards that require masking during the conformal coating process. HumiSeal® TS 300 effectively covers and protects parts and connections where coating is not desired, and can then be peeled away easily. HumiSeal® TS 300 contains no ammonia and will not inhibit thermal cure of silicone conformal coatings. HumiSeal® TS 300 can withstand limited exposure to temperatures as high as 260°C.
Cleanliness of the substrate is of extreme importance for successful application and masking of the conformal coating. Surfaces must be free of moisture, dirt, wax, grease, flux residues and all other contaminants. Contamination under the coating could cause problems that may lead to assembly failures.
Apply HumiSeal® TS 300 at a thickness of 500-1000 microns to areas on a printed circuit board where coating is not desired. Cure HumiSeal® TS 300 for one hour at room temperature, 30 minutes at 66°C, or 20 minutes at 82°C. HumiSeal® TS 300 should be completely dry before applying a HumiSeal® conformal coating. Remove HumiSeal® TS 300 from the completed board by gently peeling it away from the surface of the protected area.
| Product Specification | |
| Specific gravity at 25°C | 1.15 |
| Solids Content | 50 ± 5 % |
| Colour | Pink |
| Odor | Mild |
| Recommended Thinner | Water |
| Shelf Life, DOM | 6 months |
All values contained herein are typical values.
Please consult the Technical Data Sheet for the specific product to obtain complete information and detailed specification ranges and physical properties
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