Epoxy Encapsulation Solution 2E41T-B

Two part, thermally conductive (1.29 W/mK) epoxy system designed for the protection of electronics. Simple 1:1 mix ration with med-high viscosity. Excelent dielectric strength (500V/mil).

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Chemistry Epoxy
Viscosity Part A (CPs) 28,000
Viscosity Part B (CPs) 25,000
Mix Ratio 1:1
Pot Life (min)* 60
Handling Time (min)* 200
Full Cure** 24 hr @ RT or 2 hr @ 65oC
Cure Type Epoxy
Color Black
Hardness D60
Operating Temp (°C) -50 to 155 C
Applications Electronic and Industrial encapsulation
Substrates Metals, Glass, Ceramics, Plastic
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