Epoxy Encapsulation Solution 2E27

Two part epoxy encapsulating material specifically designed for PCB component protection. Can be used as full potting or as individual components encapsulant. Simple 1:1 mix ratio.

Technical or Safety Data Sheet | Free Sample

Chemistry Epoxy
Viscosity Part A (CPs) 5,000
Viscosity Part B (CPs) 6,000
Mix Ratio 1:1
Pot Life (min)* 15
Handling Time (min)* 60
Full Cure** 24 hr @ RT or 30 min @ 65oC
Cure Type 2 component with heat option
Color Clear
Hardness D60
Operating Temp (°C) -60 to 135 C
Applications Electronic and industrial sealing and encapsulation
Substrates Metals, Wood, Glass, Ceramics, Plastic
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