Two part epoxy encapsulating material specifically designed for PCB component protection. Can be used as full potting or as individual components encapsulant. Simple 1:1 mix ratio.
Technical or Safety Data Sheet | Free Sample
Chemistry | Epoxy |
Viscosity Part A (CPs) | 5,000 |
Viscosity Part B (CPs) | 6,000 |
Mix Ratio | 1:1 |
Pot Life (min)* | 15 |
Handling Time (min)* | 60 |
Full Cure** | 24 hr @ RT or 30 min @ 65oC |
Cure Type | 2 component with heat option |
Color | Clear |
Hardness | D60 |
Operating Temp (°C) | -60 to 135 C |
Applications | Electronic and industrial sealing and encapsulation |
Substrates | Metals, Wood, Glass, Ceramics, Plastic |
