Two part epoxy encapsulating material specifically designed for PCB component protection. Can be used as full potting or as individual components encapsulant. Simple 1:1 mix ratio.
Technical or Safety Data Sheet | Free Sample
| Chemistry | Epoxy |
| Viscosity Part A (CPs) | 5,000 |
| Viscosity Part B (CPs) | 6,000 |
| Mix Ratio | 1:1 |
| Pot Life (min)* | 15 |
| Handling Time (min)* | 60 |
| Full Cure** | 24 hr @ RT or 30 min @ 65oC |
| Cure Type | 2 component with heat option |
| Color | Clear |
| Hardness | D60 |
| Operating Temp (°C) | -60 to 135 C |
| Applications | Electronic and industrial sealing and encapsulation |
| Substrates | Metals, Wood, Glass, Ceramics, Plastic |
