Epoxy Encapsulation Solution 2E26-G

Two part epoxy potting and bonding material with easy 2:1 mix ratio. Provides good protection against high humidity, mechanical shock, and chemicals. This product is light weight with specific gravity of 0.77 and is sandable.

Technical or Safety Data Sheet | Free Sample

Chemistry Epoxy
Viscosity Part A (CPs) 60,000
Viscosity Part B (CPs) 50,000
Mix Ratio 2:1
Pot Life (min)* 20
Handling Time (min)* 160
Full Cure** 24 hr @ RT or 30 mins @ 65oC
Cure Type 2 component with heat option
Color Gray
Hardness D76
Operating Temp (°C) -60 to 120 C
Applications Potting, bonding
Substrates Metals, Wood, Glass, Ceramics, Plastics
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