Epoxy Encapsulation Solution 2E11

Formulated to work with one to two volume mix-ratio, this potting material provides superior adhesion to variaty of substrates. Medium viscosity with long work life.

Technical or Safety Data Sheet | Free Sample

Chemistry Epoxy
Viscosity Part A (CPs) 12
Viscosity Part B (CPs) 7
Mix Ratio 1:2
Pot Life (min)* 60
Handling Time (min)* 180
Full Cure** 24 hr @ RT or 1 hr @ 65oC
Cure Type 2 component with heat option
Color Amber
Hardness D40
Operating Temp (°C) -50 to 125 C
Applications Electronic sealing, bonding, and encapsulation
Substrates Metals, Glass, Ceramics, Plastics
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