Epoxy Encapsulation Solution 2E10-B

Easily mixed at 1:1 ratio. Industrial or electronic epoxy potting compound with extended work life. Provides excellent environmental and chemical resistance with high dielectric strength of 550V/mil.

Technical or Safety Data Sheet | Free Sample

Chemistry Epoxy
Viscosity Part A (CPs) 6,000
Viscosity Part B (CPs) 12,000
Mix Ratio 1:1
Pot Life (min)* 60
Handling Time (min)* 180
Full Cure** 24 hr @ RT or 1 hr @ 65oCo
Cure Type 2 component with heat option
Color Black
Hardness D85
Operating Temp (°C) -50 to 155 C
Applications Industrial sealing, bonding, and encapsulation
Substrates Metals, Glass, Ceramics, Plastics
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