Encapsulation Solutions

Encapsulating liquids for the protection of finished goods from extreme operating conditions, mechanical stresses, and electrical shock.   HumiSeal potting compounds are formulated from epoxy, urethane or acrylated urethanes.    Engineered with a variety of cure mechanisms to fit all your automotive, aerospace, industrial, or consumer goods requirements.   Our commitment to your needs goes beyond the standard product portfolio.  We will custom formulate a product to your exact needs.

Product Description Product  Description

2E11Encapsulating Solutions

Formulated to work with one to two volume mix-ratio, this potting material provides superior adhesion to a variety of substrates. Medium viscosity with long work life. Learn more.

2A14-U

Encapsulating Solutions 2E11

Two-part with simple 1:1 mix ratio. Soft, flexible, water white clear, non-yellowing, LED Encapsulation for the use of wide variety of temperature ranges. Provides good protection against high humidity, mechanical shock Read more.

2E10-B

Encapsulating Solutions 2E10-B

Easily mixed at 1:1 ratio. Industrial or electronic epoxy potting compound with extended work life. Provides excellent environmental and chemical resistance with a high dielectric strength of 550V/mil. Learn more.

2A15-B

Encapsulating Solutions 2A15-B

Two-part with simple 1:1 mix ratio. Soft, flexible, water white clear, non-yellowing, LED Encapsulation for the use in wide variety of temperature ranges. Provides good protection against high humidity, mechanical shock. Read more.

2E25

Encapsulating Solutions 2E25

Epoxy adhesive or encapsulant with a range of mix ratios and hardness resulting in high bond strength to a variety of materials. Very good electric insulator, resistant to gasses, water, petroleum products, and acids. FDA compliant. Read more.

2UV10

Encapsulating Solutions 2UV10

One part, high-shear thinning and high viscosity, outstanding wetting properties, designed for high mechanical shock protection and exceptional adhesion to a variety of materials. Will cure rapidly with exposure to UV-light and develop high adhesion properties with ambient secondary moisture cure. Read more.

2E26-G

Encapsulating Solutions 2E26-G

Two part epoxy potting and bonding material with easy 2:1 mix ratio. Provides good protection against high humidity, mechanical shock, and chemicals. This product is lightweight with a specific gravity of 0.77 and is sandable. Read more.

2A11

Encapsulating Solutions 2UV11

Two-part with simple 1:1 mix ratio. Soft, flexible, water white clear, non-yellowing, LED Encapsulation for the use in wide variety of temperature ranges. Provides good protection against high humidity, mechanical shock. Read more

2A10

Encapsulating Solutions2A10

Non-yellowing, UV stable, two-part structural adhesive and potting urethane, formulated for LED, photovoltaic, and capacitor sealing. Low viscosity with simple 2:1 mix ratio and water-white clear after full cure. Read more. 

UV12

Encapsulating Solutions UV12

One part, low viscosity and fast curing with exposure to UV light. When cured it is a water white clear, non-yellowing, rigid encapsulant for LED and other optical applications. Read more.

2A13

Encapsulating Solutions 2A13

Two-part with simple 1:1 mix ratio. Soft, flexible, water white clear, non-yellowing, LED Encapsulation for the use in wide variety of temperature ranges. Provides good protection against high humidity, mechanical shock. Read more. 

UV13-W


Encapsulating Solutions UV13

One part with medium viscosity encapsulant. Cures with UV light exposure and has secondary moisture cure for shadow areas. Provides excellent protection against moisture and high mechanical stresses. Designed for high throughput environments. Read more.

2UV11

Encapsulating Solutions 2UV11

Two-part with medium viscosity, UV gelable urethane potting system designed for high-end electronic protection. This soft encapsulant will protect components from high impact and vibration in high humidity operating conditions. Read more. 

2E41T-B

Encapsulating Solutions 2UV11

Two-part, thermally conductive (1.29 W/mK) epoxy system designed for the protection of electronics. Simple 1:1 mix ration with med-high viscosity. Excellent dielectric strength (500V/mil). Read more. 

2E42T-B

Encapsulating Solutions 2UV11

Two-part, thermally conductive (1.29 W/mK) epoxy system designed for the protection of electronics. Simple 1:1 mix ration with med-high viscosity. Excellent dielectric strength (500V/mil). Read more.