Electrically conductive, silver filled epoxy adhesive paste recommended for bonding and sealing electronic applications which require a combination of good mechanical and electrical properties (3×10-4 Ω*cm). Creates strong, durable, bonds between dissimilar materials. Complies with NASA’s Outgassing Spec.
|Viscosity Part A (CPs)||650,000|
|Viscosity Part B (CPs)||700|
|Pot Life (min)*||30|
|Handling Time (min)*||60|
|Full Cure**||24 hr @ RT or 1 hr @ 100oC|
|Cure Type||2 component with heat option|
|Operating Temp (°C)||-60 to 125 C|