Epoxy Adhesive 2E32-G

Electrically conductive, silver filled epoxy adhesive paste recommended for bonding and sealing electronic applications which require a combination of good mechanical and electrical properties (3×10-4 Ω*cm). Creates strong, durable, bonds between dissimilar materials. Complies with NASA’s Outgassing Spec.

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Chemistry Epoxy
Viscosity Part A (CPs) 650,000
Viscosity Part B (CPs) 700
Mix Ratio  100:6
Pot Life (min)* 30
Handling Time (min)* 60
Full Cure** 24 hr @ RT or 1 hr @ 100oC
Cure Type 2 component with heat option
Color Silver
Hardness D85
Operating Temp (°C) -60 to 125 C
Applications Solder Replacement
Substrates Metals, plastics
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