Epoxy Adhesive 1E31-G

General purpose adhesive or encapsulant. Medium viscosity with 1:1 mix ratio. Medium hardness with good flexibility. Wide range of applications with bonding capabilities to multiple substrates.

Request Data Sheets | Free Sample

Chemistry Epoxy
Viscosity Part A (CPs) Thixotropic
Viscosity Part B (CPs)
Mix Ratio
Pot Life (min)* Until exposed to heat
Handling Time (min)*
Full Cure** 2 hr @ 120oC
Cure Type Heat
Color Silver
Hardness D80
Operating Temp (°C) -20 to 150 C
Applications Solder Replacement
Substrates Metals, plastics
Request a Adhesive Solution Free Sample