Adhesives Solutions

Liquids for the bonding of a variety of materials capable of withstanding mechanical shock, electrical exposure, and severe weathering. HumiSeal adhesives are formulated from urethane, epoxy, or urethanes and are efficiently cured with UV light, heat, or at room temperature. If your application requires a set of properties that are not available in standard product portfolio, our R&D scientists can provide you with a customary solution.

Product Description Product Description

2A20

General purpose adhesive or encapsulant. Medium viscosity with 1:1 mix ratio. Medium hardness with good flexibility. A wide range of applications with bonding capabilities to multiple substrates. Learn more.

UV23LV

High strength, chemical resistant, low outgassing polymer system capable of surviving exposure up to 200°C. One part, UV/cationic cure epoxy adhesive. Read more.

2A20HV

General purpose adhesive or encapsulant. High viscosity with 1:1 mix ratio and long work life. Medium hardness with good flexibility. A wide range of applications with bonding capabilities to multiple substrates. Learn more.

UV21

One part, medium viscosity, fast curing urethane acrylate that bonds a wide variety of different substrates. Exhibits good surface wetting and adhesion to glass, metals, and a wide variety of plastic based substrates.Read more.

2E24

Toughened 5 min epoxy adhesive capable of performing at low temperatures and bonding to wet surfaces. Thixotropic with 1:1 mix ratio. Will bond to a variety of substrates. Read more.

UV22

One part, med-high viscosity, fast curing urethane acrylate that bonds a wide variety of different substrates. Toughened adhesive that exhibits good surface wetting and adhesion to glass, metals, and a wide variety of plastic based substrates. Read more.

2E25

Epoxy adhesive or encapsulant with a range of mix ratios and hardness resulting in high bond strength to a variety of materials. Very good electric insulator, resistant to gasses, water, petroleum products, and acids. FDA compliant. Read more.

UV20GEL

One part, high-shear thinning, thixotropic paste designed for high mechanical shock protection and exceptional adhesion to a variety of materials. Will cure rapidly with exposure to UV-light and develop high adhesion properties with ambient secondary moisture cure. Read more.

2E26

Toughened adhesive or encapsulant designed for high humidity environments. High viscosity with 2:1 mix ratio. High resistance to physical shock, exposure to water, or chemicals. Read more.

UV20HV

One part, high-shear thinning and high viscosity, outstanding wetting properties, designed for high mechanical shock protection and exceptional adhesion to a variety of materials. Will cure rapidly with exposure to UV-light and develop high adhesion properties with ambient secondary moisture cure. Read more.

2E26-G

Two part epoxy potting and bonding material with easy 2:1 mix ratio. Provides good protection against high humidity, mechanical shock, and chemicals. This product is lightweight with specific gravity of 0.77 and is sandable. Read more.

UV23

One part, UV/cationic cure epoxy adhesive. Capable of high-temperature performance with good chemical and moisture resistance. Read more.

1E31-G

One part, thixotropic, Silver filled epoxy system to be used as a solder replacement. Quick cure providing excellent electrical conductivity (3×10-4 Ω*cm), high temperature and chemical resistance. Read more.

2E32-G

Electrically conductive, silver filled epoxy adhesive paste recommended for bonding and sealing electronic applications which require a combination of good mechanical and electrical properties (3×10-4 Ω*cm). Creates strong, durable, bonds between dissimilar materials. Complies with NASA’s Outgassing Spec. Read more.

2E33-G

Long work life, two-part, silver filled epoxy system designed to be used as a solder replacement. Thixotropic cured at room temperature in 24-48 hours or accelerated with heat. Provides a high amount of flexibility, excellent electrical conductivity (1×10-4 Ω*cm), and chemical resistance. Read more.