HumiSeal® Acrylic Gel is a fast drying, single component, thixotropic acrylic paste that provides excellent moisture and environmental protection for printed circuit assemblies. HumiSeal® Acrylic Gel has been designed for use with our acrylic conformal coatings. HumiSeal® Acrylic Gel can be used for sealing, damming and to provide an extra level of protection around component leads. HumiSeal® Acrylic Gel fluoresces under UV light for ease of inspection and is easily repaired. HumiSeal® Acrylic Gel is in full compliance with the RoHS Directive 2002/95/EC.
Application of HumiSeal® Acrylic Gel
Cleanliness of the substrate is of extreme importance for the successful application of a Acrylic Gel. Surfaces must be free of moisture, dirt, wax, grease, and all other contaminants. Otherwise, ionic or organic residues on the substrate could be trapped under Acrylic Gel and cause problems with adhesion or electrical properties. The highest long term reliability for a coated printed circuit assembly will be when Acrylic Gel is applied over a clean, dry substrate.
The application of Acrylic Gel over no clean flux is a common practice. The user should perform adequate testing to confirm compatibility between Acrylic Gel and their particular assembly materials and process conditions. Please contact HumiSeal for additional information.
HumiSeal® Acrylic Gel is intended for automated needle dispensing, but may also be applied manually.
|Density, per ASTM D1475||0.95 ± 0.02 g/cm3|
|Recommended Thickness||≤ 3mm|
|Tack Free Time||10 min @ 80°C|
|Recommended Curing Conditions||3 hrs @ 80°C|
|Time Required to Reach Optimum Properties||7 days|
|Recommended Stripper||HumiSeal® Stripper 1080, 1080EU|
|Shelf Life at Room Temperature, DOM||12 months|
|Dissipation Factor, at 1MHz and 25°C, per ASTM D150-98||0.01|
|Insulation Resistance, per MIL-I-46058C||5.5 x 1014 ohms (550TΩ)|
|Moisture Insulation Resistance, per MIL-I-46058C||7.0 x 1010 ohms (70GΩ)|