HumiSeal® 1B73LOC is a low VOC solvent based conformal coating that complies with most North American air quality regulations. HumiSeal® 1B73LOC is a fast drying, single component, acrylic coating intended for printed circuit assemblies. Cured HumiSeal® 1B73LOC fluoresces under UV light for ease of inspection and is easily repaired. HumiSeal® 1B73LOC coating is MIL-I-46058C qualified, IPC-CC-830 and RoHS Directive 2011/65/EU compliant and recognized under UL File Number E105698.
Conformal coatings can be successfully applied to substrates that have been cleaned prior to coating and also to substrates assembled with low residue “no clean” materials. Users should perform adequate testing to confirm compatibility between the conformal coating and their particular assembly materials, process conditions and cleanliness level. Please contact HumiSeal® for additional information.
Depending on the complexity, density and configuration of components on the assembly, it may be necessary to reduce the viscosity of HumiSeal® 1B73LOC with HumiSeal® Thinner 701 in order to obtain a uniform film. Once optimum viscosity is determined, a controlled rate of immersion and withdrawal (5-15 cm/min) will further ensure even deposition of the coating and ultimately a uniform film. During the application, evaporation of solvent causes an increase in viscosity that should be adjusted by adding small amounts of HumiSeal® Thinner 701. Viscosity in the dip tank should be checked regularly, using a simple measuring device such as a Zahn or Ford viscosity cup.
HumiSeal® 1B73LOC can be sprayed using conventional spraying equipment. Spraying should be done in an environment with adequate ventilation so that the vapour and mist are carried away from the operator. The addition of HumiSeal® Thinner 701 is necessary to ensure a uniform spray pattern resulting in pinhole-free film. The amount of thinner and spray pressure will depend on the specific type of spray equipment used and operator technique.
HumiSeal® 1B73LOC may be brushed with a small addition of HumiSeal® Thinner 701. Uniformity of the film depends on component density and operator’s technique.
|Density, per ASTM D1475||1.23 ± 0.03 g/cm³|
|Solids Content, % by weight per Fed-Std-141, Meth. 4044||26 ± 2 %|
|Viscosity, per Fed-Std-141, Meth. 4287||445 ± 30 centipoise|
|Drying Time to Handle per Fed-Std-141, Meth. 4061||25 minutes|
|Recommend Coating Thickness||25 – 75 microns|
|Recommended Curing Conditions||24 hrs @ RT or 2 hrs @ 76°C|
|Time Required to Reach Optimum Properties||7 days|
|Recommended Thinner||HumiSeal Thinner 701|
|Recommended Stripper||HumiSeal Stripper 1080, 1080A|
|Shelf Life at Room Temperature, DOM||24 months|
|Thermal Shock, 50 cycles per MIL-I-46058C||-65°C to 125°C|
|Coefficient of Thermal Expansion – TMA||67 ppm/°C|
|Glass Transition Temperature – DSC||42°C|
|Modulus – DMA||11.1 MPa|
|Flammability, per UL 94||V-0|
|Dielectric Withstand Voltage, per MIL-I-46058C||>1500 volts|
|Dielectric Breakdown Voltage, per ASTM D149||6300 volts|
|Dielectric Constant, at 1MHz and 250C per ASTM D150-98||2.6|
|Dissipation Factor, at 1MHz and 250C per ASTM D150-98||0.01|
|Insulation Resistance, per MIL-I-46058C||5.5 x 1014 ohms (550TΩ)|
|Moisture Insulation Resistance, per MIL-I-46058C||7.0 x 1010 ohms (70GΩ)|
|Fungus Resistance, per ASTM G21||Passes|