TSD
MSDS

Description

TempSeal (HumiSeal TS300) is a non-flammable, high temperature, temporary mask specially designed and formulated to be used on printed circuit boards that require masking during the conformal coating process. TempSeal effectively covers and protects parts and connections where coating is not desired. TempSeal can remain on the board until ready for test. The mask is removed by applying a mild peeling action. TempSeal contains no ammonia and will not inhibit thermal cure silicone conformal coatings. Since TempSeal can survive short excursions to temperatures as high as 500°F, it can also be used as a temporary solder masking material.